Non-Conductive Thermal Paste Silicone Grease Compound Carbon Based High Performance Non-Conductive (1 PCS)

• Thermal heatsink paste with a conductivity of 1.93 W/m-k ensures effective dissipation of heat generated by the CPU or GPU.
• The Thermal Compound with low thermal resistance remains pliable over time. It has a broad operating temperature range, ensuring stable performance in environments from -30 to 280. With superior heat dissipation and cost-effectiveness, its performance does not degrade over time.